Amkor Technology Posts Record Revenue in Computing and Automotive on Q3 2026 Call

Amkor Technology reported record revenue in its Computing and Automotive and Industrial end markets on its third-quarter 2026 earnings call, held on October 26, 2026. The Motley Fool covered the call. Amkor is a semiconductor packaging and test company that assembles chips for customers, including advanced packaging used in artificial intelligence hardware.

Amkor's Advance Payments and Advanced Packaging Growth

Chief Financial Officer Megan Faust said Amkor has executed advance payment arrangements with a dozen customers since 2025, primarily supporting advanced packaging capacity across Korea and Arizona. Several more customer agreements are under discussion, she said. "Customers are funding this expansion through upfront cash commitments to lock in multiyear production space," Faust said.

Chief Executive Officer Kevin Engel said the company's flagship High-Density Fan-Out CPU program is scaling. An additional High-Density Fan-Out CPU program for a hyperscaler began ramping in the third quarter, and two new 2.5D programs in networking and data center are expected to come online in the fourth quarter. "Our flagship HDFO CPU program is scaling," Engel said.

Amkor is shifting lower-margin System-in-Package work from Korea to Vietnam, freeing clean room space in Korea for higher-margin advanced packaging tools for data center customers. "The released space in Korea is being redeployed and quickly consumed by advanced packaging customers," Engel said. Faust said computing growth is cushioning broader softness across smartphone and consumer electronics markets, and that a richer mix of advanced packaging revenue and strong execution drove meaningful margin expansion.

Amkor's Earlier 2026 Expansion and Results

Amkor forecast total revenues to increase 14.0% in 2026 and 11.8% in 2027 as it expands its global manufacturing footprint across Asia, Europe and the U.S., Yahoo reported on August 31, 2026. Simply Wall St reported on August 27, 2026 that Amkor's second-quarter 2026 results showed double-digit year-over-year revenue growth across computing, automotive, industrial and communications, driven by advanced packaging and AI data center demand.

How Amkor Compares With Packaging Peers

ASE Technology Holding expects gross margins in its packaging and testing business to stay above 30% in 2027, citing growing demand for AI-related advanced packaging, DIGITIMES Asia reported on October 30, 2026. AUO is pushing into optical communications and advanced semiconductor packaging, with optical engines and glass core substrates as its two primary technological pillars and a goal of major revenue contribution within 2 to 3 years, DIGITIMES Asia reported on October 30, 2026. HANMI Semiconductor will hold an investor relations group meeting on November 5, 2026, to review third-quarter 2026 results and its 2027 business outlook, The future of trading reported on November 3, 2026.

Amkor's Fourth-Quarter 2.5D Programs

Amkor expects two new 2.5D programs in networking and data center to come online in the fourth quarter of 2026, according to Engel's remarks on the call.