NSING Technologies Passes 250 Million Bluetooth Chips Shipped Using Ceva IP

NSING Technologies has shipped more than 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth Low Energy IP, Ceva announced on November 5, 2026. The milestone covers a long-standing collaboration between the two companies across wearables, consumer electronics, smart home, automotive and industrial applications, PR Newswire reported.

How NSING Built Its Bluetooth Portfolio on Ceva IP

NSING Technologies built its Bluetooth product line on Ceva-Waves Bluetooth LE IP, pairing Ceva's connectivity technology with its own low-power RF designs and MCU architectures. The company said this combination let it develop integrated, power-efficient Bluetooth solutions while speeding product development and keeping performance and standards compliance consistent across product generations.

The collaboration spans several generations of NSING Bluetooth products, including the N32WB452 series of dual-core Bluetooth LE MCUs and the N32WB03x series of ultra-low-power Bluetooth LE SoCs. These chips support electronic toll collection systems, wireless remote controls, smart lighting, e-bike security systems, indoor positioning and industrial wireless connectivity.

"Reaching 250 million Bluetooth chip shipments reflects the strength of our product portfolio and the trust our customers place in our technology," said Xinhui Mu, Vice President at NSING Technologies. "Ceva has been a valued technology partner in our growth, and we look forward to building on this success as we expand our presence in new markets and applications."

Ceva appointed Ziv Hammer as Executive Vice President of its Connectivity & Sensing Division, Yahoo reported on September 26, 2026. "The scale of NSING Technologies' Bluetooth shipments illustrates the tremendous reach of wireless connectivity and the role Ceva plays in enabling it," Hammer said in the announcement. "With billions of Ceva-powered devices deployed worldwide, milestones like this demonstrate how our IP licensing model translates into sustained, high-volume production and long-term royalty opportunities."

Ceva's Ceva-Waves portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput, Wi-Fi and Ultra-Wideband IP, supported by integrated hardware and software. The company said its wireless connectivity IP is licensed by semiconductor companies worldwide and deployed in billions of devices.

NSING's Listing and Product Record

NSING completed a listing on the main board of the Hong Kong Stock Exchange in March 2026, according to akta.pro company records. The same records show NSING launched its N32H7 high-performance MCU series in September 2025, a dual-core Cortex-M7 and Cortex-M4F family with an integrated GPU and JPEG codec aimed at embodied robotics and industrial automation.

Ceva's November 9 Earnings Date

Ceva will announce its third-quarter 2026 results on November 9, 2026, before the NASDAQ market opens, Stock Titan reported. The company also scheduled a conference call for the release.