Foxconn Debuts NVIDIA DSX POD Token Factory Design at Hon Hai Tech Day 2026

Foxconn Technology Group showcased the NVIDIA DSX POD, a standardized, factory-built reference design for preintegrating NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, at its seventh annual Hon Hai Tech Day on October 30, 2026. PR Newswire said the event featured a record 321 exhibits.

Foxconn's NVIDIA DSX POD and Token Factory Zone

The Foxconn Technology Group DSX POD lets partners preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery. A quarter of the 321 exhibits made up the Token Factory zone, which included a 20-meter wall of PCBs mounted with tens of thousands of micron-level components, a cable-free, hose-free and fanless compute tray design, co-packaged optics and power, cooling and high-speed data solutions. An immersive simulated AI data hall demonstrated how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution.

"Foxconn is transforming into a technology manufacturing platform service provider," said Foxconn Chairman Young Liu. "From testing to the tangible, our vertical integration and precision manufacturing makes the impossible possible. We are building this kind of strength across ecosystems of smart consumer electronics to AI and EV, as well as in space and robotics."

Visionbay.ai, Foxconn's dedicated business unit for AI supercomputing and cloud operations and an NVIDIA Cloud Partner, is planning its facility design to follow NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt within a fixed power envelope and optimize computing, power and cooling configurations ahead of construction. The event also included a customer zone with key moment photos and milestone technology timelines, and a Precision Manufacturing zone with technologies behind Poketomo AI companion robots and one-punch laptop enclosures.

Foxconn's AI Infrastructure Partnerships

According to akta.pro company records, Foxconn and Schneider Electric formed a strategic partnership on June 15, 2026, to co-develop integrated infrastructure solutions for AI data centers, combining Foxconn's AI computing platforms and manufacturing with Schneider Electric's power distribution, cooling and energy management systems. The same records show Foxconn and Intel announced a strategic partnership at Computex 2026 to jointly develop next-generation AI infrastructure and intelligent computing platforms, including AI data center equipment with Intel Xeon processors, AI accelerator chips and custom chip development.

Foxconn's Earlier AI Factory and Rack Launches

Foxconn launched an AI factory using an Nvidia DGX SuperPOD with Blackwell GB200 chips on October 26, 2026, training 120B-parameter models 2.48x faster than H100 systems, Crypto Briefing reported. On October 14, 2026, Foxconn showcased rack-scale AI infrastructure at the OCP Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery and liquid cooling, DIGITIMES Asia reported. Foxconn is also continuing work to convert its former GM plant in Lordstown, Ohio, into a facility producing data center components like server racks, Yahoo reported on October 29, 2026.

Hon Hai Tech Day 2026 Dates and Venue

HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day conference launched a family-friendly pavilion for children to experience hands-on exploratory themes including sustainability, mobility, smart factory and smart city.